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K & H Advanced Solderless Breadboard - 360 Tie Points

£7.92

Type Prototyping Breadboard. Total of 360 tie points. Number of Points 360. Allows up to 5 connections to each pin of ICs placed across the central gap. Length 81mm. Board Thickness 9mm. Sockets are on a 2.54mm matrix, allowing all dual-in-line integrated circuits, plus many other components to simply be plugged into the board.

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